Wireless audio system motherboard
Product parameters reference:
Brand: Newei
Processing type: SMT patch
Product type: Electronic terminals, office equipment
Production equipment: SMT machine, reflow soldering, SPI, AOI, IC burning
Quality Standard: ISO9001
Factory Address: Fuyong, Baoan, Shenzhen, Guangdong, China
PCB Assembly Capability (Detailed Parameters)
Solder TypeLead-free (Compliant with RoHS Standards)
Assembly TimeOnce all components are ready, from 24 hours to 7 days
Maximum PCB Size
550*460*5mm
Minimum PCB Size
50*50*0.8mm
Assembly TypeSurface Mount (SMT) Assembly
Ball Grid Array (BGA) Components
Mixed Technology (SMT and Through-hole)
Through-hole Assembly
Mixed Assembly
Board TypesRigid Printed Circuit Boards, Flexible Printed Circuit Boards, Metal Core Printed Circuit Boards, Rigid-Flex Printed Circuit Boards
BGA Minimum Spacing
0.2mm
Maximum Component Size
50*50*15mm
Assembly SideSingle/Double-sided
Minimum Component Specification
01005/0402
Tags: motherboard /Wireless_audio_system /