Smart glasses motherboard

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Smart glasses motherboard

Product parameters reference:

Brand: Newei

Processing type: SMT patch

Product type: Electronic terminals, office equipment

Production equipment: SMT machine, reflow soldering, SPI, AOI, IC burning

Quality Standard: ISO9001

Factory Address: Fuyong, Baoan, Shenzhen, Guangdong, China

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SMT ASSEMBLY CAPABILITY OF NEWEI

NEWEI offers high-quality and highly reliable PCB assembly service. Our PCB assembly factory has 8 fully automatic high-speed surface mount production lines and uses the most advanced SMT PCB assembly equipment. Including automatic board loading machine, automatic solder paste printing machine, solder paste thickness detector (SPI, Solder Paste Inspection), multi-temperature zone reflow soldering machine, optical inspection equipment (Automatic Optical Inspection), X-ray inspection machine, baking machine, and PCB stencil cleaning machine, etc.

Printed Circuit Boards (PCBs)have changed the concept of soldering components with wire and creating a complicated and unreliable circuit. PCBs are very compact and offer reliable performance for a very long time. They take up very little space and deliver the expected results.

Nowadays, PCBs are used in almost every industry. Every product that requires some components and their interconnection uses a PCB. PCBs have gone through many changes in the past few decades. There have been many advancements, improvements, and new technologies. One of the leading PCB technologies is surface mount technology. It has supreme importance because it has further reduced the size of PCBs. The components used in the surface mount technology are minimal; the smallest SMD (surface mount device)has a dimension of 0.6mm x 0.30mm. SMT technology has significantly impacted the PCB industry and is widely used nowadays.

Technical Capabilities

PCB Assembly Capability (Detailed Parameters)

Solder TypeLead-free (Compliant with RoHS Standards)

Assembly TimeOnce all components are ready, from 24 hours to 7 days

Maximum PCB Size

550*460*5mm

Minimum PCB Size

50*50*0.8mm

Assembly TypeSurface Mount (SMT) Assembly

Ball Grid Array (BGA) Components

Mixed Technology (SMT and Through-hole)

Through-hole Assembly

Mixed Assembly

Board TypesRigid Printed Circuit Boards, Flexible Printed Circuit Boards, Metal Core Printed Circuit Boards, Rigid-Flex Printed Circuit Boards

BGA Minimum Spacing

0.2mm

Maximum Component Size

50*50*15mm

Assembly SideSingle/Double-sided

Minimum Component Specification

01005/0402

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Tags: motherboard /Smart-glasses /

If you are interested in our products, please contact us.

Contact Us

Office Address: 3 Floor, Building D1, Xintang Industrial Zone, East District, Baishixia Community, Fuyong Street, Baoan District, Shenzhen city, 518100 China
Tel:+86-18925218989
+86-755-27813348
E-Mail: tiger.wang@richitek.com

Smart glasses motherboard

Smart glasses motherboard

SMT ASSEMBLY CAPABILITY OF NEWEI

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