Quick sampling of PCB circuit boards

Quick sampling of PCB circuit boards

We are extremely skilled in providing customers with the shortest 24-hour fast circuit board sampling service. When your company needs fast circuit board sampling, you only need to deliver the documents to us, and you can receive high-quality circuit boards in a very short time, with very attractive price competitiveness. In addition, we will also reflect the design issues found during the sampling process of your PCB circuit board in the trial production report. All DFM manufacturability checks and process problem discovery reports during production are free of charge. Many PCB rapid prototyping companies in the market combine more than ten types of boards for cutting and production, which can lead to many quality hazards. However, we only produce separate samples for each PCB to ensure quality and reduce the accuracy of PCB circuit simulation verification.

PCB circuit board processing

PCB multilayer boards and complex processes

Supports complex processes such as 1-36 layer multi-layer boards, HDI, blind buried holes, BGA, in tray holes, gold fingers, resin plug holes, laser drilling, and 3mil line width line spacing.

How to obtain PCB circuit board quotations?

Fill out PCB inquiry form online or email PCB Gerber file to email tiger.wang@richitek.com, Please reply to your inquiry within 1 hour at the earliest.

PCB sample display

As a leading PCB manufacturing supplier, we have obtained certifications such as ISO9001, ISO13485, IATF16949, etc. Some of the manufactured circuit board samples are as follows:

PCB process capability

Maximum number of floors 40L

Maximum plate thickness 8.0mm

Minimum plate thickness 0.4mm

Maximum thickness to diameter ratio 14:01

Maximum copper thickness 10OZ

Maximum working plate size 2000x610mm

The thinnest 4-layer board is 0.33mm

Minimum mechanical hole/pad 0.15/0.35mm

Drilling accuracy+/-0.025mm

PTH aperture tolerance+/-0.03mm

Minimum line width/line spacing 0.065/0.065mm

Surface treatment ENIG/OSP/HASL/Au Plating (soft/hard)/Immersion Ag/Immersion Tin/Bright Tin Plating/Ag Plating/Carbon Ink

Support the production of HDI, blind buried holes, and FPC flexible circuit boards